In most cases, the modern electronic system design includes the design of a variety of components or isolation of each other near the system. The design of the IC and the pin output are determined by the position of the circuit on the chip. The package designer by "thrown over the wall" chip design, and as far as possible to design shorter bond wire package, allowing encapsulated as small as possible. And the PCB designer, have often been complaining, pick up the IC package, rack their brains to find signal wiring method, which looks like misplaced in a tube feet or solder balls on.
With the increasing complexity of SoC, and the development of multi chip packaging, the company has begun to recognize the value of the IC, the package substrate and the PCB design group. Due to the characteristics of the cost sensitivity of the number of executive foot devices, engineers have to reconsider the I/O layout and optimize the IC layout of the chip in the same time, when the complexity of the package variables are compromised. And all these jobs are performed on a number of board level platforms. Now, the emergence of a variety of tools to make the package and PCB design into a cooperative, mutually beneficial process.
To maximize the effect, the EDA tool should be aware of the tools used in other processes. In the field of packaging and PCB design, very little understanding of each other. Admittedly, the FPGA pin output can be defined by the user in a certain range, but the "standard" components generally do not have this option.
Make it clear to the design and other aspects of the product design process, these tools will be able to work together in a shorter time and pay a better system design. In addition, the standard IC chip can be packaged in different ways, depending on the shape of the end product parameters, so as to achieve a more optimal solution for a variety of ways.
How to quickly communicate with each other, and then cooperate to deliver a more optimal design? The design of smart phones and tablet PCs using the same CPU chip can perfectly explain the pattern. Apparently, many Mobile Devices Inc are doing this.
Now, using a new tool, designers can configure the chip, from the perspective of the package to see the design, and then transferred to the PCB (traditional method), or to understand the PCB design requirements, and then return to the package design. Moreover, they can get every use of the CPU products, and then come back from the PCB design specifically designed to optimize the best package.
From the point of view of encapsulation, the physical design rules are decided by the PCB design requirements. Then, tools and rules and packaging designers interact to deliver the best package that is applicable to the particular application of the chip. This relatively fast package design method can explore different ideas, to quickly find the best solution.
Tool cognitive design has significant advantages, and it can be designed and optimized in any design field. First of all, it can more easily customize the design of a number of packages in order to follow the desired shape parameters to the best use of a given component. Then from the multiple hypothesis situation analysis to examine the design, such as smaller packages, less cost, the most simple fanout and export. Secondly, due to the existence of a large number of pins, the use of electronic forms and pin list package design is not. Error rate is almost 100% when manual input of hundreds of pins is entered. Of course, its advantages include: improved quality, access to the best package for the appropriate shape parameters, error reduction, as well as a large number of times in the entire system design.