Innovation is the driving force for the sustainable development of PCB industry

- May 19, 2016-

Printed circuit board (PCB) is indispensable to modern electronic equipment accessories, both on the world sea of high-end electronic equipment and home appliances and electronic toys, less not load PCB electronic components and electrical signals, and PCB is with the development of the electronic information industry and development.

Printed circuit innovation, first of all, PCB products and market innovation. The earliest PCB product is a single panel, only a layer of conductor on the insulation board, line width in millimeters, is used in the commercialization of semiconductor (transistor) radio. Later, with the advent of television, computer and so on, PCB products will be innovative, there are double-sided board, multilayer board, the insulation board has two or more layers of conductors, the line width is also gradually reduced. In order to adapt to the miniaturization of electronic equipment, lightweight development, and there has been a flexible PCB and flexible combination of PCB.

Now, the main PCB market in computer and peripheral equipment, communications equipment (base station and handheld terminals, etc.), home electronics (televisions, cameras, game consoles and other) and automotive electronics and other fields, PCB products with a multilayer and high density interconnect (HDI) plate. With the computer to the high speed and large capacity, mobile phone to the multifunctional intelligent, TV to high-definition 3D, car to the high security of intelligent direction of development, HDI PCB also from the wire connection function to change the function of electronic circuit, PCB products in addition to the basic line conductor, also contains the resistors, capacitors and other passive components and IC chip and other active components. The new generation of HDI printing plate is the internal components of the embedded components printed board. The updated printed board is suitable for high frequency and high speed signal transmission applications, and PCB layer will contain fiber and waveguide, which constitute a suitable 40GHz for signal transmission.

Because PCB products continue to innovate, so that we have ushered in the spring of a printed circuit development. Intelligent mobile phone will bring the high tide of embedded components, LED energy saving lighting will bring the climax of the metal base printed board, electronic books and thin film display will bring the climax of the flexible circuit board.

Printed circuit innovation, based on technological innovation. Traditional PCB manufacturing technology is copper foil etching method (subtraction), namely for copper - clad insulating substrate by chemical etching solution to remove unwanted copper layer and leave need copper conductor formed line graph; for interconnection between layers of double-sided and multilayer is conduction by drilling and electroplating copper implementation. Now the traditional process has been difficult to adapt to the micron fine line HDI board production, fast and low cost production is difficult to achieve, it will be difficult to achieve the purpose of energy saving and emission reduction, green production, only through technological innovation in order to change this situation.

High density is the eternal theme of PCB technology. The characteristics of high density are more fine lines, smaller interconnection holes, higher layers and more thin. Such as now the PCB width / from conventional capabilities have been from 100 m refinement to 75 mu m and 50 m, after a few years will be refined to 25 m, 20 m, therefore, must carry out reform and innovation copper foil etching process.

For printed circuit technology innovation, people have been in pursuit of semi additive process and hydrosilylation reaction technology, namely on the insulating substrate deposited copper layer to form a line graph. This is the improvement of the traditional subtraction, although progress but still need a lot of energy, and the cost is also high. The new path of innovation is printed electronic circuit (PEC), which has brought revolutionary changes to the PCB product and production process. Printed electronic circuit technology uses pure printing method for electronic circuit diagram, namely the screen printing and offset printing or inkjet printing process, the function of ink (conductive ink, ink of semiconductor, dielectric ink, etc.) printed on the insulating substrate, required for electronic circuits. The technology can simplify the production process, save raw materials, reduce pollutants, reduce production costs, if equipped with to Roll Roll processing equipment, but also to achieve high volume, low cost production.

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