Technology

Capabilities Overview


Layers:

Rigid PCB 2 - 24 + Layers , Rigid-flex PCB 1 - 10Layers

Panel Size(max):

21" x 24"

PCB Thickness:

0.016" to 0.120"

Line & Spaces:

0.003" / 0.003" Inner Layers;0.004" Outer Layers

Hole Size:

0.006" Thru Hole (Finished Size) and 0.004" Buried Via,

Materials:

FR4,High Tg ,Rogers,Halogen-free material ,Teflon,Polyimide

Surface Finishes:

ENi/IAu,OSP,Immersion Silver,Immersion Tin

Special Products:

Blind/Buried Via(HDI 2+N+2),Rigid Flex

More Information

Minimum Hole Position Tolerance

±0.075mm

Hole Size Tolerance

±0.05mm(PTH)

±0.05mm (NPTH)

Outline Dimension Tolerance

±0.13mm

Conductor Width Tolerance

±0.05mm or ±20% of Original Artwork

Warp & Twist Ratio

0.70%

Insulation Resistance For E/T test

10K Ω-20M Ω

Conductivity Resistance For E/T test

<50 Ω  

Voltage For E/T test

300v maximum

Registration Tolerance Front/Back Image

0.075mm

Layer to Layer Registration

0.075mm

Board Thickness Tolerance

±8%(t≥;1.0mm)

±0.1(t<1.0mm)

Aspect Ratio

10:01

Plugging hole Diameter with solder mask

0.20mm-0.60mm

Minimum Solder dam Width

0.1mm

Minimum Solder Mask Clearance

0.05mm

Solder Mask Type/Silkscreen Ink

LPI(green, white, black ,red ,etc)

Impedance Control tolerance

±10%

Minimum Board thickness for V-Groove process

0.6mm

Remained Board thickness for V-Groove process

0.3mm

Thickness Tolerance for V-Groove process

±0.1mm

Minimum Spacing From V-Groove to Conductor

0.4mm

Slot Dimension Tolerance(Length/Width),Length>=2*Width

±0.125mm/±0.1mm

Au thickness

0.0762um-0.762um(Hard Au)

0.0254um-0.127um(Soft Au)

Ni thickness

2.032-7.362um

We accept CAM350, GC-CAM, Gerber, Gerber 274x, PROTEL 99SE, Eagle file, DXP, Power PCB data for producing pcbs . Our experienced engineers who understand customer's requirement very well ensure smooth and fast communication and feedback with customers. Besides, they can give valued suggestion from customer's design.